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U/D
DRYER
F/R
HQDR
CH2
O/F
CH1
L/D |
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2500¡¿1400¡¿2050mm(W¡¿D¡¿H) |
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* Generals of device
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1. Purpose : This is automatic wafer treatment system
which remove oxide on silicon
HF, DI.Water and dry it
2. Water size : 4~8" Silicon wafer
3. Treatment : 2 cassette (1 Patch 50 sheets)
4. Cassette : A200-80MG (Flouroware made)
5. Direction : From left to right |
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* Utility |
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