WET BENCH HALF AUTO WET CLEAN BENCH
TUBE CLEANER PARTS CLEANER
DI-WATER HEATER AUTOMATIC ORGANIC STRIP BENCH SPECIFICATION
 
 
  L/D SPM QDR BOE O/F APM QDR F/R DRYER U/D
  590014502630mm(WDH)
 
* Generals
1. Purpose : This is automatic process equipment cleaning silicon wafer by using chemical & DIW and     drying unit.
2. Application wafer : 4~8" Silicon wafer
3. Application cassette : 2 cassette (1patch) 50 sheets
4. Process type : A200-80MG and PA200-80MG (Flouroware made)
5. Process direction : From left to right
6. Equipment : The above specification subject to minor change
* Utility