· In PR Strip process, lift off unnecessary metal with resist,
while remaining metal pattern.
· Wafer Size : 4 ~ 6inch
· Chamber : 2ea / 1Floor type (4~8Chamber 구성 가능)
· Chemical Supply : CCSS or LCSS type
· Sub unit : Steam generator / Micro bubbler + DIW unit
· Control method : PC or PLC control / Scheduler control