· Wafer 표면 세정 설비로 다양한 공정에 대응 가능 하다.
· Wafer Size : 150mm ~ 200mm
· Process Direction : From left to right / From right to left
· Robot System : 2 ~ 4set [ Robot safety interlock ]
· Front Door : Slide open type
· Chemical Supply : CCSS or LCSS type
· Control method : PC or PLC control / Scheduler control
Application field
- - RCA cleaning
- - Particle removal
- - Nitride film removal
- - Oxide film removal
- - Polymer removal
- - Resist Strip Station